Coating forming device and coating forming method for forming metal coating
US10151042B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Mar 8, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating forming device for forming a metal coating on a surface of a substrate includes: an anode; a power supply; and a solid electrolyte membrane disposed between the anode and the substrate and contains metal ions. The solid electrolyte membrane includes: a contact surface that is a region contacting a coating-forming region where the metal coating is formed; and a concave portion recessed relative to the contact surface such that, when the contact surface contacts the coating-forming region, the solid electrolyte membrane is not in contact with a portion of the surface of the substrate excluding the coating-forming region. The metal ions are reduced to form the metal coating on the coating-forming region by the power supply applying a voltage between the anode and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.