Electronic devices for high temperature drilling operations
US10151195B2 · kind B2 · utility
0Cited by
7References
6Claims
0Family size
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Inventors
Key dates
| Filing date | Apr 29, 2014 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Feb 5, 2035 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/017
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present disclosure provides the printed circuit board assembly suitable for operating downhole at high temperatures. The printed circuit board assembly has a ceramic circuit board with a plurality of chips installed on it. At least one of the chips has an aluminum nitride or a silicon nitride substrate. In some of the chips, aluminum nitride is used as the oxide layer in a Si-on-Insulator configuration. In other chips, integrated circuits are fabricated on a substrate made from aluminum nitride, silicon nitride, silicon carbide, or sapphire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.