Patent · US Active

Flow sensor package

US10151612B2 · kind B2 · utility

2Cited by

7References

19Claims

0Family size

Assignee

Sensirion AG · CH

Inventors

Werner Hunziker · Männedorf, CH
Mark Hornung · Männedorf, CH
Eric Monnin · Kehlhof, CH

Key dates

Filing date	Nov 30, 2015
Grant date	Dec 11, 2018
Priority date	—
Expiry date	Sep 24, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A flow sensor package comprises a chip comprising a sensitive structure for sensing the flow of a fluid and an encapsulation at least partly encapsulating the chip. A recess in the encapsulation contributes to a flow channel for guiding the fluid, which recess exposes at least the sensitive structure of the chip from the encapsulation, and which recess extends beyond an edge of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.