Structurally encoded component and method of manufacturing structurally encoded component
US10152661B2 · kind B2 · utility
108Cited by
1References
20Claims
0Family size
Inventor
Key dates
| Filing date | Jan 10, 2017 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Jan 10, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K2019/06253
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of inserting a data structure into a component using a 3D printer is provided. The method includes providing the data structure having at least one structural parameter associated with the component, converting the data structure into indicia representative of the data structure, and manufacturing the component containing the indicia.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.