Light emitting device and method of manufacturing light emitting device
US10153411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2017 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Nov 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. The bottom surface includes a light emitting element mounting region in the first part and a groove surrounding the light emitting element mounting region. A light emitting element is mounted on the light emitting element mounting region. A light-transmissive resin is provided in the recess to be in at least a part of a groove surface. A light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.