Package structure for ultraviolet light-emitting diode
US10153412B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
Abstract
The present embodiment discloses a package structure for ultraviolet LED, which comprises a substrate, an ultraviolet light-emitting diode (LED), and an optical device. The wavelength of the light emitted by the ultraviolet LED is between 200 and 400 nm. The optical device includes amorphous silicon dioxide, and thus enabling the transmittivity of ultraviolet light greater than 80%. In addition, by including a reflective ring and a metal film, the material aging problem of the sealing material can be prevented by blocking direct ultraviolet-light illumination. The package structure according to the present invention overcomes the limitation on planar packaging, so that the applications of backend processes can be extended.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.