Multilayer microwave filter
US10153531B2 · kind B2 · utility
2Cited by
3References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 7, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Sep 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/12
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A radio frequency filters and methods for implementing the filters in multilayer metallic-dielectric structures, such as printed circuit boards (PCB), low temperature co-fired ceramic (LTCC) components and integrated circuits (IC). The methods and filters utilize vertical stacking of transmission lines and related frequency-selective structures to obtain compact implementation of filters of high order. The methods and filters are applicable to a variety of filter types and related structures such as multiplexers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.