Molded acoustic mesh for electronic devices
US10154327B2 · kind B2 · utility
2Cited by
20References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Aug 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device has a speaker housing secured within the device housing. The speaker housing has a cavity with a speaker at one end and a port at the other configured to communicate through an aperture in the housing of the electronic device. A panel of acoustic mesh is integrally formed within the cavity of the housing and is disposed between the port and the speaker. In other embodiments flexible structures are integrally molded onto a plate or the acoustic device and used to secure and acoustically seal the acoustic device within the device housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.