Gradient micro-electro-mechanical systems (MEMS) microphone
US10154330B2 · kind B2 · utility
3Cited by
9References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2014 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Sep 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.