Electronic device and heat dissipation structure thereof
US10154613B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2018 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device and a heat dissipation structure thereof are provided. The electronic device comprises a first shell body; a second shell body, mutually pivoted with the first shell body; and a heat dissipation structure, including a first heat conducting member and a second heat conducting member, wherein the first heat conducting member is disposed in the first shell body and extended with a first arc-shaped piece, the second heat conducting member is disposed in the second shell body and extended with a second arc-shaped piece, and the second arc-shaped piece is arranged to be thermally in contact with the first arc-shaped piece and capable of sliding and rotating relative to the first arc-shaped piece. Accordingly, thermal energy can be transferred from the shell body having a heat unit to the other shell body, thereby increasing the heat dissipation efficiency of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.