Integral metallic joint based on electrodeposition
US10154617B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An electronic assembly, including an encasement joined from at least two casing parts, wherein at least one gap region between two mutually adjoining casing parts is hermetically sealed by a metal layer that is electrodeposited onto the sections of the adjoining casing parts abutting the gap region and bridges the gap region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.