Manufacturing method of casing
US10154620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2016 |
| Grant date | Dec 11, 2018 |
| Priority date | — |
| Expiry date | Oct 18, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49966
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a casing is provided. First, a plate, a frame and a main shell are provided, wherein the plate has an adhering region and at least one thermal fusion region, and the frame has a first surface and a second surface opposite to each other. Then, the plate is stacked on the first surface of the frame, wherein the thermal fusion region is overlapped with the frame, and the adhering region is not overlapped with the frame. The main shell is adhered to the adhering region of the plate and the second surface of the frame. The thermal fusion region is fixed to the frame by thermal fusion. In addition, a casing manufactured through the above-mentioned method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.