Laminated, leak-resistant chemical processors, methods of making, and methods of operating
US10155213B2 · kind B2 · utility
1Cited by
15References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2016 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Dec 23, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides methods of making laminated devices (especially microchannel devices) in which plates are assembled and welded together. Unlike conventional microchannel devices, the inventive laminated devices can be made without brazing or diffusion bonding; thus providing significant advantages for manufacturing. Features such as expansion joints and external welded supports are also described. Laminated devices and methods of conducting unit operations in laminated devices are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.