Patent · US Active

Methods and process flows for diffusion bonding and forming metallic sheets

US10155281B2 · kind B2 · utility

0Cited by
3References
20Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 29, 2016
Grant dateDec 18, 2018
Priority date
Expiry dateFeb 20, 2037

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF05D2230/236
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Methods and process flows for diffusion bonding and forming metallic sheets are disclosed herein. The methods include stacking a first metallic sheet and a second metallic sheet to define a sheet stack. The methods further include creating a pneumatic seal between the first metallic sheet and the second metallic sheet to define a sealed sheet stack that defines a pneumatically isolated region. The methods also include increasing a surface area of the sealed sheet stack to define an expanded sheet stack. The methods further include compressing at least a portion of the expanded sheet stack to form a diffusion bond between a corresponding portion of the first metallic sheet and an opposed portion of the second metallic sheet thereby defining a diffusion bonded sheet stack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.