Vascular structures and methods for heat management
US10155547B1 · kind B1 · utility
5Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2017 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Sep 15, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60R16/08
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
Systems and methods are provided for heat management using vascular channels. Vascular channels are incorporated in a network within a component. The component is a part of a manufactured product and defines an exterior panel. A fluid circuit is connected with the vascular channels and circulates a fluid through the component to collect heat from the product and to dissipate heat through the exterior panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.