Methods and apparatus concerning solution shearing a transparent and conductive polymer film
US10155876B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Oct 27, 2016 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Oct 27, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Various embodiments include apparatus and methods of forming an apparatus using a solution shearing process. An example method includes providing a shearing blade on a portion of a substrate coated with a polymeric conductor material and controlling generation of a transparent and conductive polymer film on the substrate by moving the shearing blade in a direction, to generate shear stress to the polymeric conductor material, and according to shearing deposition parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.