Hot melt adhesive composition including a block composite compatibilizer

US10155889B2 · kind B2 · utility

Assignee

• DOW GLOBAL TECHNOLOGIES LLC · US

Inventors

• Yi Jin · Irvine, US
• Kim L. Walton · Lake Jackson, US
• Gary R. Marchand · Lake Jackson, US
• Selim Yalvac · Midland, US
• Allan Walter Mclennaghan · Lachen, CH
• Burcak Conley · Zürich, CH
• Dean Lee · Midland, US
• Rongjuan Cong · Lake Jackson, US
• Colin Li Pi Shan · Pearland, US

Key dates

• Filing date: Aug 20, 2015
• Grant date: Dec 18, 2018
• Expiry date: Aug 20, 2035

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2453/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.