Solid composition comprising a polysaccharide and a hydrophobic compound, the process and use thereof
US10155918B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2014 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2034 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD06M2200/50
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a solid composition comprising a polysaccharide and a hydrophobic compound having a melting point of between 30° C. and 90° C. The solid composition may further comprise a quaternary ammonium compound, wherein the weight ratio of the polysaccharide and the hydrophobic compound is between 1:50 and 50:1. Preferably, the solid composition is substantially free or completely free of water. The solid composition shows excellent stability at a temperature up to 45° C. The present invention also provides a process for preparing the solid composition and a liquid composition comprising said solid composition, and a method for conditioning a fabric by using said solid composition or said liquid composition as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.