Apparatus for direct-write sputter deposition and method therefor
US10156011B2 · kind B2 · utility
0Cited by
5References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 22, 2015 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Feb 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3438
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microplasma sputter deposition system suitable for directly writing two-dimensional and three-dimensional structures on a substrate is disclosed. Deposition systems in accordance with the present invention include a magnetic-field generator that provides a magnetic field that is aligned with the arrangement of an anode and a wire target. This results in a plasma discharge within a region between a wire target and an anode that is substantially a uniform sheet, which gives rise to the deposition of material on the substrate in highly uniform and radially symmetric fashion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.