Automated microdissection instrument for determining a location of a laser beam projection on a worksurface area
US10156501B2 · kind B2 · utility
5Cited by
182References
4Claims
0Family size
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Key dates
| Filing date | Feb 16, 2017 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Feb 16, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1054
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.