Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device
US10157694B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Oct 22, 2014 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Nov 7, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/505
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This copper alloy for an electronic/electric device includes Mg at an amount of 3.3 atom % to 6.9 atom % with a remainder substantially being Cu and inevitable impurities, wherein a strength ratio TSTD/TSLD is more than 1.02, and the strength ratio TSTD/TSLD is calculated from a strength TSTD measured by a tensile test carried out in a direction perpendicular to a rolling direction and a strength TSLD measured by a tensile test carried out in a direction parallel to the rolling direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.