High throughput substrate handling endstation and sequence
US10157763B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2013 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Nov 11, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for facilitating expeditious handling and processing of semiconductor substrates with a minimal number of handling devices. Such a system may include an entry load-lock configured to transfer substrates from an atmospheric environment to a vacuum chamber, an alignment station disposed in the vacuum chamber and configured to adjust orientations of substrates, a first vacuum robot configured to move substrates from the entry load-lock to the alignment station, a process station disposed in the vacuum chamber and configured to perform a designated process on substrates, first and second exit load-locks configured to transfer substrates from the vacuum chamber to the atmospheric environment, and a second vacuum robot configured to move substrates from the alignment station to the process station and further configured to move substrates from the process station to the first exit load-lock and to the second exit load-lock in an alternating fashion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.