Electronic apparatus
US10157834B1 · kind B1 · utility
11Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2017 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Sep 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus is provided. The electronic apparatus includes an integrated fan-out package, a dielectric housing, and a plurality of conductive patterns. The dielectric housing is covering the integrated fan-out package, wherein a gap or a first dielectric layer is in between the dielectric housing and the integrated fan-out package. The plurality of conductive patterns is located on a surface of the dielectric housing, wherein the plurality of conductive patterns is located in between the dielectric housing and the integrated fan-out package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.