Array substrate, fabrication method for forming the same, and display device containing the same
US10157938B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 7, 2016 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Nov 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/441
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application discloses a fabrication method for forming an array substrate, including: forming, in a fanout region, a first signal-load line connected to a first group of data lead wires, and a second signal-load line connected to a second group of data lead wires; and forming, in the fanout region, at least one unidirectional device at a connection point of the first signal-load line and a data lead wire, at least one unidirectional device at a connection point of the second signal-load line and a data lead wire. The first signal-load line and the second signal-load line are each configured to transmit an external testing signal along a single direction to the data lead wires through the unidirectional devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.