Optical loss management in high power diode laser packages
US10158210B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2015 |
| Grant date | Dec 18, 2018 |
| Priority date | — |
| Expiry date | Apr 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4012
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high power diode laser module is provided with improved high temperature handling and reliability, the module including a housing made of a thermally conductive material and providing a module interior extending between a plurality of housing surfaces, at least one diode laser disposed in the module interior and situated to emit a laser beam, one or more optical components disposed in the module interior and coupled to the at least one diode laser so as to change one or more characteristics of the laser beam, a waveguide in optical communication with the module interior and situated to receive the laser beam from the one or more optical components, and an optical absorber disposed in the housing and situated to receive stray light which is associated with the laser beam and which is propagating in the module interior so as to absorb the stray light and conduct heat associated with the stray light away from the module interior and into the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.