Methods and systems for reinforced adhesive bonding using solder elements and flux
US10160066B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2016 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jan 7, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates a bonding system formed by a process that provides a first substrate and a second substrate. A flux coating is applied to the first contact surface, and a solder-adhesive mixture comprising an adhesive and a plurality of solder elements in at least a portion of the adhesive is applied to the first contact surface. The second substrate is positioned adjacent the solder-adhesive mixture much that a second contact surface of the second surface is opposite the first contact surface, and heat is applied to the solder-adhesive mixture by way of at least one of the first and second contact surfaces. The solder-adhesive mixture is heated to a temperature that is intended to at least partially melt or at least partially vaporize the flux coating upon contact to promote a bonding condition between the solder-adhesive mixture and the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.