Patent · US Active

Rigid high pressure laminates (HPL)

US10160259B2 · kind B2 · utility

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11Claims

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Assignee

LAMITECH S.A.S. · CO

Inventors

Guillermo Ochoa · Bogota, CO
Juan M. Gonzalez · Mahtomedi, US
Mauricio Arango · Bogota, CO

Key dates

Filing date	Apr 25, 2016
Grant date	Dec 25, 2018
Priority date	—
Expiry date	Sep 20, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB32B2451/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method for producing rigid high pressure laminates (HPL) with an embossed-in-structure texture on the surface, wherein a first structure embossed on the surface of the HPL is in perfect alignment with a second identical structure printed on the decor sheet of the HPL.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.