Simplified MEMS device fabrication process
US10160641B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Mar 24, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Mar 24, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/056
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.