Method for forming metal particle layer and light emitting device fabricated using metal particle layer formed by the method
US10161046B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
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Key dates
| Filing date | Jul 22, 2013 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Nov 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a method for forming a metal particle layer having irregular structures in a simpler manner. The method includes bringing a base into contact with an activation solution including a metal compound, an organic acid activator, and a complexing agent. The base is oxidized by the organic acid activator to produce electrons and the metal compound is reduced by the electrons to deposit metal particles on the surface of the base. Also disclosed is a method for fabricating a light emitting device with improved light extraction efficiency that uses a metal particle layer formed by the above method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.