Reduced stress pressure sensor

US10161817B2 · kind B2 · utility

Assignee

• InvenSense, Inc. · US

Inventors

• Felix Mayer · Männedorf, CH
• Marc Von Waldkirch · Männedorf, CH
• Johannes Buhler · Uster, CH
• Rene Hummel · Baar, CH
• Stephan Braun · Kehlhof, CH
• Marion Hermersdorf · Rödermark, DE
• Chung-Hsien Lin · Hsinchu, TW

Key dates

• Filing date: Oct 23, 2014
• Grant date: Dec 25, 2018
• Expiry date: Oct 15, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49204
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.