Optical transmitter assembly for vertical coupling
US10162135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jun 26, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4257
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to an optical transmitter assembly (OTA) for vertical coupling of light into a chip, and to a method for manufacturing the OTA. The OTA includes a laser diode, a microlens and a turning mirror mounted at a top face of a supporting substrate within a sealed enclosure, and an optical component, such as an optical isolator, a polarizer, or a microlens disposed in a substrate cavity that opens to the back face of the substrate. The optical component may be placed into the cavity after the enclosure is sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.