Method and system for removing heat using heat removal liquid based on workload of server components of electronic racks
US10162396B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Apr 18, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid control architecture is designed to control a liquid flow rate based on the workload of the IT components of an electronic rack, which provides sufficient cooling capability to each IT component, saving a total cost of pump energy. A coolant distribution unit (CDU) is included in each electronic rack to pump a liquid flow to a liquid supply manifold of the electronic rack. Each outlet on the supply manifold provides heat removal liquid to each IT component (e.g., one or more GPUs of a server blade) using flexible tubing. The liquid heat removal system utilizes the workload of each IT component to drive the CDU pump speed. In addition, the temperature of the IT components rather than return liquid temperature is utilized as a baseline to monitor the temperature of the electronic rack and change the control logic (e.g., liquid flow rate) as needed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.