Semiconductor device, method and tool of manufacture
US10163642B2 · kind B2 · utility
0Cited by
16References
17Claims
0Family size
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Key dates
| Filing date | Oct 3, 2016 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Oct 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing tool and process to form semiconductor devices is provided. An edge ring of the semiconductor manufacturing tool comprises a high electron mobility material in order to extend an electrical field and sheath such that curvature from the sheath is moved away from a semiconductor wafer so that an impact from the curvature is reduced or eliminated during an etching process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.