Sensor device with media channel between substrates
US10163660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | May 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.