Manufacturing method for electronic element
US10163769B2 · kind B2 · utility
1Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Aug 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13019
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a manufacturing method for an electronic element of an electronic apparatus. The electronic element includes a substrate, a bump and at least one under bump metal (UBM) layer. The manufacturing method includes sequentially disposing the UBM layer and the bump onto the substrate; and processing an etching operation at the UBM layer to form a breach structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.