Electronic device
US10163775B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2016 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Oct 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an electronic device suitable for miniaturization. The present electronic device includes: a substrate (1), having a main surface (111) and a back surface (112) facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component (8), which is disposed over the substrate (1); and a conductive layer (3), which is electrically connected with the electronic component (8); wherein a recess for disposing the component (14) and a through recess (17) are formed in the substrate, in which recess for disposing the component (14) is recessed from the main surface (111), and the through recess (17) penetrates from the recess for disposing the component (14) to the back surface (112); the electronic component (8) is disposed over the recess for disposing the component (14); a metal-filled portion (4) is formed in the through recess (17), wherein the metal-filled portion blocks at least the bottom of the through recess (17) and is filled with a metal material; and the conductive layer (3) is formed at least from the through recess (17) to the back surface (112).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.