Power electronic switching device, arrangement herewith and methods for producing the switching device

US10164026B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Harald Kobolla · Seukendorf, DE
• Jörg Ammon · Erlangen, DE

Key dates

• Filing date: Jul 19, 2017
• Grant date: Dec 25, 2018
• Expiry date: Jul 19, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/7998
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A switching device has a substrate and a power semiconductor component, comprising a connection device and a pressure device wherein the substrate has tracks electrically insulated from one another. The power semiconductor component is on one of the tracks with a first main surface and is conductively connected thereto. The device is embodied as a film composite having a conductive film and an insulating film that forms a first and a second main surface. The switching device is connected internally in a circuit-conforming manner by the connection device and a contact area of the connection device is connected to a first contact area of one of the tracks in a force-locking and electrically conductive manner. There is a pressure body projecting to the substrate and pressing onto a first section of the second main surface of the film composite.