MEMS component and method for encapsulating MEMS components

US10164166B2 · kind B2 · utility

Assignee

• SnapTrack, Inc. · US

Inventors

• Hans Kruger · Birkenfeld, DE
• Alois Stelzl · Munich, DE
• Christian Bauer · Neu-Ulm, DE
• Jürgen Portmann · Munich, DE
• Wolfgang Pahl · Munich, DE

Key dates

• Filing date: Nov 22, 2017
• Grant date: Dec 25, 2018
• Expiry date: Nov 22, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16225
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.