Isolating noise sources and coupling fields in RF chips
US10164681B2 · kind B2 · utility
2Cited by
57References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die comprises a first active device, at least one of a second active device and a passive component, and electromagnetic shielding configured to at least partially electromagnetically isolate the first active device from the at least one of the second active device and the passive component. The electromagnetic shielding includes one of a grounded metal layer and via stack, and a grounded metal layer disposed one of above and below the first active device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.