Method for metalizing vias
US10165681B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2013 |
| Grant date | Dec 25, 2018 |
| Priority date | — |
| Expiry date | Jul 26, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2111/00844
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.