Patent · US Active

Soldering pump

US10166619B2 · kind B2 · utility

0Cited by

14References

12Claims

0Family size

Assignee

ERSA GMBH · DE

Inventors

Simon Hame · Kreuzwertheim, DE
Richard Kressmann · Monsheim, DE

Key dates

Filing date	Oct 14, 2016
Grant date	Jan 1, 2019
Priority date	—
Expiry date	Oct 14, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH02K44/06
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A soldering pump for pumping an electrically conductive fluid—in particular, a liquid solder—said soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.