Low cost wafer level process for packaging MEMS three dimensional devices

US10167190B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Andrei A. Shkel · Irvine, US
• Alexandra Efimovskaya · Irvine, US
• Doruk Senkal · San Jose, US

Key dates

• Filing date: Feb 14, 2017
• Grant date: Jan 1, 2019
• Expiry date: Mar 5, 2037

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/019
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown “bubble-shaped” structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create “bubbleshaped” glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.