Cooling using adjustable thermal coupling
US10168749B2 · kind B2 · utility
6Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2016 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Dec 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.