Focus ring for plasma processing apparatus
US10170283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2015 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Jul 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32642
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a focus ring formed without an adhesive that can suppress abnormal electric discharge and obtain uniform plasma environment in a circumferential direction in a plasma processing apparatus. The focus ring includes a plurality of arc-shaped members and a plurality of connecting members connecting the plurality of the arc-shaped members to form a ring shape without an adhesive, and is formed such that a thickness between an upper surface of the connecting member and a bottom surface of a concave fitting portion of the connecting member is greater than a thickness between an upper surface of the arc-shaped member and a bottom surface of a second depression of the arc-shaped member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.