Electronic component package and method of manufacturing the same
US10170386B2 · kind B2 · utility
34Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2017 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Aug 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.