Backside initiated uniform heat sink loading
US10170391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2014 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Sep 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49352
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.