Integrated power module
US10170401B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2016 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Sep 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated power module comprising a power board including at least one power switching device, a driver board including at least one driver for driving a gate of the at least one power switching device, and an interconnection extending across the power board and the driver board mechanically connecting the power board and the driver board together. Included are a lead frame to which the power board and the driver board are mounted, and a package encapsulating the power board and the driver board mounted on the lead frame. Also disclosed is a method for manufacturing the integrated power module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.