Semiconductor device
US10170402B2 · kind B2 · utility
1Cited by
0References
11Claims
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Assignee
Inventors
Key dates
| Filing date | Feb 11, 2016 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Jul 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a wiring substrate having an upper surface, a plurality of terminals formed on the upper surface, and a lower surface opposite to the upper surface, a first semiconductor chip having a first main surface, a plurality of first electrodes formed on the first main surface, and a first rear surface opposite to the first main surface, and mounted over the upper surface of the wiring substrate such that the first rear surface of the first semiconductor chip faces the upper surface of the wiring substrate, and a plurality of wires electrically connected with the plurality of terminals, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.