Camera module with integrated chip-on-board image sensing chip
US10171715B2 · kind B2 · utility
1Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2017 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Jan 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.