Housing with electronic components
US10172247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2017 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Dec 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An enclosure for electronic components with a base and a capping forming a room for receiving at least one circuit board at least one circuit board support positioned on the base for the support of the at least one circuit board. At least one fastening element attaches the at least one circuit board to the circuit board support through an engagement with the circuit board support, wherein the capping is formed and/or attached to the base in such a manner that room is formed between the fastening element and the capping in such a manner that a detachment of the fastening element from the circuit board support is prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.